對(duì)此,新華三首席執(zhí)行官于英濤的觀點(diǎn)是,新華三將本著高技術(shù)、高標(biāo)準(zhǔn)的原則,在繼續(xù)采用全球技術(shù)領(lǐng)先的商用芯片合作伙伴解決方案的同時(shí),按需融入自主創(chuàng)新的解決方案配套芯片,形成優(yōu)勢(shì)互補(bǔ),在為新華三帶來更大的行業(yè)領(lǐng)先優(yōu)勢(shì)。
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NAND Flash方面,美光2019年主流將向96層3D NAND轉(zhuǎn)移,容量以量產(chǎn)512Gb為主,3月份已基于96層3D NAND推出了美光1300系列SSD和microSD卡產(chǎn)品。至于3D Xpoint技術(shù),即可作為能運(yùn)算的擴(kuò)充DRAM,也可以做快速儲(chǔ)存需求的NAND擴(kuò)充替代,美光預(yù)計(jì)在2019會(huì)計(jì)年度進(jìn)行送樣,快在2020會(huì)計(jì)年度量產(chǎn),將會(huì)專注數(shù)據(jù)中心存儲(chǔ)應(yīng)用。
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